/ Corporate / Topcon Announces Next Generation 3-D Mobile Mapping System

Topcon Announces Next Generation 3-D Mobile Mapping System

Matt Ball on October 7, 2014 - in Corporate, Maintenance, Sensors

LIVERMORE, Calif., Oct. 7, 2014—Topcon Positioning Group announces the latest edition to its line of 3-D mobile mapping systems – the IP-S3. The fully integrated high-density digital imaging system is more compact, lightweight, and designed to scan at a rate up to five times faster than previous models.

Scanning at 700,000 points-per-second, the system is designed to offer data-rich results with its 30 MP panoramic imagery. Weighing 18 kg (39 lb.), the IP-S3 is engineered to offer simplified installation.

“The IP-S3 is a mobile mapping powerhouse,” said Ian Stilgoe, director of geomatics for Topcon, “It bundles years of mobile mapping experience to glean a high-density and high-resolution camera in a unit that is much smaller than its predecessors. It is so lightweight that a single person could mount it on a vehicle without assistance from anyone else.”

The system pairs with Topcon Mobile Master Office software to perform all post-processing functions in a single application.

“Mobile Master Office software offers a complete workflow in a single package, turning raw sensor data collected by the IP-S3 system into rich and precise point clouds and images,” said Stilgoe.

The system is planned for release in late 2014.

About TOPCON POSITIONING GROUP: 

Topcon Positioning Group is headquartered in Livermore, California, USA (topconpositioning.com). Its European head office is in Capelle a/d IJssel, The Netherlands (topconpositioning.eu).

Topcon Positioning Group designs, manufactures and distributes precise positioning products and solutions for the global surveying, construction, agriculture, civil engineering, BIM, mapping and GIS, asset management and mobile control markets.

Its brands include Topcon, Sokkia and 2LS. Topcon Corporation (topcon.com), founded in 1932, is traded on the Tokyo Stock Exchange (7732).

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